Cornerstone Initiative Request (CIR) | Reshore Enhanced Secure Heterogenous Advanced Packaged Electronics(RESHAPE) 2.0 | Cornerstone Initiative Request (CIR) Number: CS-26-1301
Below is a brief summary. Please check the full solicitation before applying (link in resources section).
Executive Summary:
The Reshore Enhanced Secure Heterogenous Advanced Packaged Electronics (RESHAPE) 2.0 initiative is a major Department of Defense effort to build a U.S.-owned, domestic advanced packaging ecosystem for secure microelectronics manufacturing. The Government intends to fund multiple prototype projects that expand U.S. capabilities in advanced substrates, 2.5D and 3D packaging, fan-out packaging, RF packaging, advanced assembly, testing, and related manufacturing technologies.
This is a large-scale funding opportunity with an estimated total initiative value of $1,250,000,000 and an expected 4 to 10 awards. The Government is seeking projects that strengthen domestic supply chains, reshore advanced microelectronics manufacturing capabilities, and support Department of Defense programs.
Application deadline: 15 July 2026/12:00pm Central. Questions will not be accepted after 8 July 2026/12:00pm Central.
How much funding would I receive?
The solicitation states that the total estimated value for this initiative is $1,250,000,000.00, subject to the availability of funds. The Government intends to award multiple (estimated 4 to 10) Fixed-Price Other Transaction Agreements (OTAs).
The solicitation does not specify individual award sizes. The Government reserves the right to award all, some, or none of the proposed elements.
What could I use the funding for?
Funding is intended for prototype projects that improve U.S. advanced packaging capability and capacity for defense-related microelectronics. Projects may address one or more of the following technical elements:
Advanced Substrates
3D Packaging
Fan-Out Packaging
2.5D Packaging
Radio Frequency Packaging
Design Enablement
Department of War Multi-Chip Module Prototypes
Back-End-of-Line (BEOL) Processes
Advanced Assembly
Advanced Test and Failure Analysis
The initiative supports development of domestic capabilities for advanced system integration, secure packaging, heterogeneous integration, manufacturing infrastructure, prototyping, testing, and related technologies.
Are there any additional benefits I would receive?
Potential benefits include:
Eligibility for a prototype OTA rather than a FAR-based contract.
Potential follow-on production opportunities under 10 U.S.C. § 4022(f) if the prototype project is successfully completed.
Opportunity to participate in a national effort to establish a domestic advanced packaging ecosystem supporting Department of Defense programs and supply chain resilience.
The solicitation explicitly states that follow-on production is not guaranteed.
What is the timeline to apply and when would I receive funding?
Key dates include:
Solicitation issued: 15 June 2026
Questions accepted until: 8 July 2026/12:00pm Central
Proposal due date: 15 July 2026/12:00pm Central
White papers due: 17 July 2026/12:00pm Central
The solicitation uses a two-step process consisting of:
White Paper submission.
Full Proposal submission by invitation. The due date for full proposals will be provided in the Government's invitation.
Funding is expected to be provided through milestone-based payments upon successful completion and Government acceptance of agreed deliverables.
The solicitation does not specify when award decisions will be made or when funding will be received.
Where does this funding come from?
The opportunity is being issued by Army Contracting Command – Rock Island Arsenal (ACC-RIA) on behalf of the Combat Capabilities Development Command – Chemical Biological Center (DEVCOM CBC) in support of the Industrial Base Analysis and Sustainment (IBAS) Program (10 U.S.C. § 4817).
Funding supports the Department of Defense objective to strengthen the defense industrial base, expand domestic manufacturing capacity, and address supply chain vulnerabilities in advanced microelectronics packaging.
Who is eligible to apply?
Applicants must:
Be members with an executed Cornerstone Consortium Management Agreement.
Have an active System for Award Management (SAM) registration.
Have favorable status in the Federal Awardee Performance and Integrity Information System (FAPIIS).
Foreign participation, access, and transfers are restricted and reviewed on a case-by-case basis when determined to be in the best interest of the U.S. Government.
To satisfy OTA statutory requirements, projects must meet at least one condition described in 10 U.S.C. § 4022, including participation by a nontraditional defense contractor, participation by qualifying small businesses, qualifying cost share, or exceptional circumstances approved by the Government.
What companies and projects are likely to win?
The solicitation favors projects that:
Establish or expand domestic advanced packaging capabilities.
Strengthen supply chain resilience and reduce foreign dependencies.
Deliver measurable Government return on investment through financial, technical, or supply-chain benefits.
Support Department of War Programs of Record.
Demonstrate commercially viable business models and sustainable operations.
Provide functional prototypes with clear transition pathways.
Leverage prior Department of War and Department of Commerce investments.
Strengthen domestic workforce, manufacturing infrastructure, and technical capability.
Priority is specifically encouraged for responses that include delivery of functional prototypes capable of transitioning to Department of War Programs of Record.
Are there any restrictions I should know about?
Key restrictions include:
All manufacturing and development work must be performed within the United States.
Foreign participation is restricted and subject to Government approval.
Participation in non-U.S. research programs is restricted without Government concurrence.
Export-controlled information restrictions apply.
NIST SP 800-171 cybersecurity requirements apply.
Controlled Unclassified Information requirements apply.
The Government will seek Unlimited Rights or, at minimum, Government Purpose Rights for work performed under the project.
The security classification level is UNCLASSIFIED, although CUI requirements may apply.
How long will it take me to prepare an application?
This opportunity will likely require a significant application effort.
The solicitation requires detailed technical, manufacturing, supply chain, financial, workforce, infrastructure, ROI, commercialization, and milestone planning information. White papers are limited to 10 pages, and invited full proposals are limited to 15 pages plus appendices and supporting materials.
Applicants responding to multiple technical elements must prepare separate responses for each element.
The solicitation does not specify an estimated preparation time.
How can BW&CO help?
BW&CO can support companies by:
Assessing fit against the solicitation requirements.
Identifying the strongest technical element(s) for submission.
Developing the white paper strategy and narrative.
Building milestone-based project plans.
Preparing commercialization, ROI, and supply chain impact sections.
Developing cost-share and investment positioning.
Drafting and managing proposal submissions.
Supporting consortium participation and OTA strategy.
