DME26TZ05-NP001: Cable Connector Enhancement

Below is a brief summary. Please check the full solicitation before applying (link in resources section).

Quick Answer

The Defense Microelectronics Activity is offering a Phase I STTR award of up to $100,000 for companies developing a solution that strengthens commercial off-the-shelf cable connectors on existing circuit boards, without requiring custom cable manufacturing or board redesign. This is topic DME26TZ05-NP001 under the DoW FY26 STTR BAA Release 5. As an STTR, this topic requires a formal research institution partnership. Proposals are due September 23, 2026 through DSIP.

What This Solicitation Is

This is a Phase I STTR topic, meaning the small business must formally partner with a single Research Institution for the duration of the project. DMEA structures this Phase I specifically as a lower-cost, shorter-duration examination of concept merit rather than a full feasibility build: the award cap is $100,000 with a maximum period of performance of just 3 months, notably tighter than the standard DMEA SBIR Phase I terms.

This topic falls under the Contested Logistics Technologies critical technology area and Microelectronics component priority area. It carries a projected CMMC Level 1 requirement. Only unclassified proposals will be accepted. As with DMEA's companion SBIR release, the Company Commercialization Report WILL be considered during proposal evaluations here, which is a notable departure from most other DoW components.

Due to limited funding, DMEA reserves the right to limit awards under this topic, and only proposals considered to be of superior quality will be funded. That is a more explicit competitiveness warning than typically appears in these solicitations, worth flagging to any client considering this one.

What DAF Is Looking For

The cable-to-board connection is one of the most common failure points in electronics systems because of the thermal and mechanical stress it absorbs. For new designs, engineers can design around that risk from the start. For existing designs already in the field, options are limited. Potting protects against moisture, vibration, and shock, but potting material has to stop below the connector's electrical contact height to avoid disrupting the connection, which means the board side gets protected while the actual joint remains exposed and vulnerable to strain.

Swapping in a more specialized connector is possible if the board footprint allows it, but removing an existing connector takes significant technician time and introduces rework risk, particularly on densely populated boards where there may not be room for a heat shield to protect neighboring components during removal. Direct solder connections that eliminate the connector entirely, using something like Hot Bar Soldering, bring their own headaches: custom tooling, fixturing, and a compatible Anisotropic Conductive Film that may not exist or be sourceable in small quantities for an existing connector footprint.

DMEA wants a more versatile fix: something that strengthens the existing COTS connector itself, works across multiple connector form factors, doesn't touch core connector functionality, and is compatible with standard PCB assembly, coating, and potting processes already in use. No custom cable manufacturing or custom tooling.

Phase I is a feasibility study evaluated against these specific target requirements: operation across a -50°C to 140°C range, compatibility with MMCX, SMA, UFL, Panasonic, and Samtec connector types, compatibility with potting materials at a viscosity of 20,000 cp or higher (with the connector fully submerged in potting, not just protected below the contact area), suitability for small densely populated boards, and demonstrated compatibility with existing manufacturing techniques. The solution also needs a credible path to passing MIL-STD-202 Method 201A vibration testing, MIL-STD-202 Method 213B condition B shock testing, and MIL-STD-810 Method 501.5 and 503.5 thermal testing.

Phase II moves into actual physical testing across all of those environmental conditions, plus expanded testing at higher potting viscosities up to 60,000 cp, long-term electrical testing at three temperature conditions over durations up to 4 weeks, and investigation into compatibility with additional connector types beyond the original five. DMEA wants repeatable data and expects performers to provide sample materials or tools needed to replicate the enhancement.

Funding and Timeline

Phase I award maximum is $100,000 with a maximum period of performance of 3 months. The technical volume page limit is 10 pages, and proposals exceeding that will be deemed non-compliant and will not be evaluated.

Phase II, available only to Phase I awardees, has an award maximum of $1,340,000 with a maximum period of performance of 24 months, and a technical volume limit of 40 pages. Phase I awardees can submit a Phase II proposal without invitation up to 60 calendar days after the Phase I contract ends. Phase II awards are subject to available funding regardless of proposal quality, and proposals must remain valid for 180 days after submission.

Technical and Business Assistance funding is available at up to $6,500 per Phase I project and up to $50,000 per Phase II project.

Proposals are due September 23, 2026 through DSIP. Firms will be notified of Phase I selection status within 90 days of the topic closing date.

Who Should Apply

This topic fits companies with materials science or electronics packaging backgrounds, particularly those with experience in conformal coatings, potting compounds, or connector reinforcement techniques, combined with a research institution partner capable of environmental and mechanical stress testing. Companies coming from ruggedized electronics, aerospace, or marine electronics backgrounds, where connector reliability under harsh conditions is already a familiar problem, have a natural fit. Because this is explicitly framed as a short, narrow concept-merit study rather than a full engineering build, a company with a clear, testable materials or coating innovation is better positioned than one proposing an open-ended research program.

Eligibility and Compliance Notes

As an STTR, this requires a formal partnership with a single Research Institution. Percentage of Work requirements follow the standard DoW STTR calculation and DMEA does not permit deviations. Subcontractor, consultant, and facility lease costs combined may not exceed one third of the total contract price or cost unless separately approved in writing by the Contracting Officer.

Cost sharing is permitted but not required and will not be used as an evaluation factor.

Only unclassified proposals will be accepted.

Frequently Asked Questions

What is the proposal deadline?
September 23, 2026, submitted electronically through DSIP.

How much funding is available for Phase I?
Up to $100,000 with a maximum period of performance of 3 months, plus up to $6,500 in Technical and Business Assistance funding.

How much funding is available for Phase II?
Up to $1,340,000 with a maximum period of performance of 24 months, plus up to $50,000 in Technical and Business Assistance funding.

Does this require a university or research institution partner?
Yes. As an STTR topic, the small business must formally partner with a single Research Institution to meet program eligibility requirements.

What connector types does the solution need to support?
At minimum, MMCX, SMA, UFL, Panasonic, and Samtec connectors.

What environmental standards does the solution need to pass?
MIL-STD-202 Method 201A for vibration, MIL-STD-202 Method 213B condition B for shock, and MIL-STD-810 Method 501.5 and 503.5 for thermal testing, expanding to additional MIL-STD-810 methods in Phase II.

Is award funding guaranteed for high-quality proposals?
No. DMEA explicitly states that due to limited funding, only proposals considered to be of superior quality will be funded, and Phase II award ability is subject to available funds regardless of merit.

What is the technical volume page limit?
10 pages for Phase I, 40 pages for Phase II.

What happens in Phase III?
The solution could be marketed to other defense contractors, consumer electronics companies, or hobbyist markets, as well as directly to DoD and other government agencies deploying electronics in harsh environments.