Flexible Printed Thermoelectric Cooling Film - STTR Topic DON26TZ01-NV013

Disclaimer:
This topic was temporarily posted by the Department of War SBIR Program on March 2nd 2026 and removed the following day.
We believe this topic is planned to be released once the SBIR program is reauthorized; however, this topic may ultimately be modified or withdrawn.

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Funding Amount:

Est. $240,000

Deadline to Apply:

Est. April 29th, 2026.

Objective:

Develop a low-cost and lightweight thermoelectric cooling film that could be used to cool the warfighter (small scale) or surfaces on military platforms (larger scale) using printed organic semiconductors. The flexible cooling films should have a bending radius of less than one inch to easily wrap around pipes, wrists, and ankles, and be able to conform to complex curvatures on larger surfaces.

Description:

Thermoelectric cooling devices based on narrow bandgap semiconductors such as bismuth telluride are commercially available. They are solid state devices and thus do not have the large footprint and moving parts associated with vapor compression refrigeration systems; however, they operate with lower efficiency. They are well-suited for cooling small flat surfaces where one is more concerned with the form factor than efficiency. For many practical applications, these square ceramic tile thermoelectric devices are heavy and too rigid, and do not offer conformal contact to curved surfaces.

Over the past fifteen years, a lot of progress has been made on organic thermoelectric materials. Though the thermoelectric figure of merit (ZT) has not caught up to that of bismuth telluride and other inorganic materials, the potential to make low-cost, lightweight, and flexible devices has opened a new application space for thermoelectric cooling where flexibility and large-area conformal contact are prioritized over efficiency. For instance, lightweight headbands and wristbands only need to remove a small amount of heat to provide significant cooling sensation to the user. Likewise, there are diffuse, large surface area applications with similar cooling needs. Prior research was summarized in a recent review article by Segalman [Ref 1].

The conducting polymer Poly(3,4-ethylenedioxythiophene) [PEDOT] was identified as a strong candidate for the p-type leg in the p-n device, but device performance has been limited by the lack of suitable n-type materials. The organic electronics community has long wrestled with n-type materials due to potential oxidation of the electron carriers. A number of inherently stable and high performing n-type polymers have recently been developed [Ref 2] that should complement the available p-type materials and enable significantly improved thermoelectric cooling device performance. New device designs obtainable with simple fabrication must be developed to take advantage of the anisotropic thermal conductance and charge transport in these materials, which is typically maximized in-plane and along the polymer molecular backbones, such that measured thin film behaviors successfully translate into device performance. A number of design and fabrication strategies have been demonstrated but much more innovation is possible [Ref 1]. It is an appropriate time to develop lightweight, flexible thermoelectric cooling devices for these niche applications.

This STTR topic is for low-cost, lightweight, and flexible thermoelectrics for personal cooling as well as for large area applications.

The flexible cooling films should have a bending radius of less than one inch to easily wrap around pipes, wrists, and ankles, and be able to conform to complex curvatures on larger surfaces. The stated applications are near-ambient temperatures though the conjugated polymers should be able to handle temperatures up to 200°C. Composite approaches that are appropriate are welcome. This topic is not soliciting a fabric-based solution.

Who will win?

If you can achieve the objective above better than any other company on the market, you have a very high-likelihood of success and should apply.

Who is eligible to apply?

Any company that meets the following criteria:

• For-profit company

• U.S.-owned and controlled.

• 500 or fewer employees (including affiliates)

How Can BW&CO Help?

1) End-to-end support including, strategy, writing of the full proposal, and administrative & compliance support.

2) Proposal strategy and review.

3) Administrative & compliance support.

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