NextFlex Project Call 11.0: Flexible Electronics

Executive Summary

NextFlex, the Manufacturing USA institute for flexible hybrid electronics, plans up to about $3M for about three projects that mature and integrate conformable and stretchable electronics. Teams match funds at least 1:1. Cover sheets are due December 2, 2026; full proposals December 9, 5:00 PM PT.

Book a Free Fit Call

The deciding factor is cost share and team makeup. Every project must match institute funds at least 1:1, include at least one corporate or industrial organization, and spend all funds in the U.S. Funded teams that are not members must join NextFlex at a qualifying membership tier.

Solicitation at a Glance

  • Organization: NextFlex, the Manufacturing USA institute for flexible hybrid electronics
  • Opportunity: Project Call 11.0 Part II: Industrialization and Integration
  • Funding: Up to about $3.0M total; up to $500,000 in institute funds each for Topics 11.4 and 11.5, and up to $1,000,000 for Topic 11.6; about one project per topic
  • Cost Share: At least 1:1
  • Duration: Up to 18 months (Guidebook v1.0)
  • Due Dates: Mandatory cover sheet December 2, 2026; full proposal December 9, 2026, 5:00 PM PT

Think your company qualifies? Talk with BW&CO before the December 2, 2026 deadline.

Book a Free Fit Call

What Is Project Call 11.0?

Project Call 11.0 Part II is a NextFlex funding call for projects that mature, qualify and integrate conformable and stretchable flexible hybrid electronics. It is a single-stage call: teams send a mandatory cover sheet, then a full proposal.

What Problem Is NextFlex Trying to Solve?

Flexible hybrid electronics have moved past early research, but many technologies still need maturation, qualification and integration work before manufacturers can adopt them. This call funds that industrialization step.

Funding and Award Terms

  • Total: up to about $3.0M
  • Per project: up to $500,000 in institute funds for Topics 11.4 and 11.5, and up to $1,000,000 for Topic 11.6
  • Awards: about one project per topic
  • Cost share: at least 1:1
  • Duration: up to 18 months per the Guidebook (the call web page says 15 months; the Guidebook governs)

Eligibility

  • Membership: you do not need to be a member to submit; funded non-members must join NextFlex at a qualifying tier (not Observer or Associate) before the agreement is final
  • U.S. presence: teams need a significant presence in the U.S., and all funds must be spent in the U.S.
  • Team: teams should include at least one corporate or industrial organization

How to Apply

  • Read the Guidebook: download Guidebook v1.0 from the NextFlex Project Call 11.0 page
  • Send the cover sheet: the cover sheet is mandatory and due December 2, 2026
  • Line up cost share: confirm at least 1:1 matching funds or in-kind support
  • Submit the full proposal: by December 9, 2026, 5:00 PM PT

What Happens After You Submit?

  • Review: NextFlex evaluates proposals against the call criteria
  • Selection: about one project is funded per topic
  • Membership: funded non-members join NextFlex before the agreement is finalized

Is This Opportunity a Good Fit for Your Company?

It fits companies with printed, stretchable or conformable electronics technology that is ready for qualification and integration work, especially teams with a manufacturing partner and matching funds. It is a weak fit for early research or teams that cannot meet the 1:1 cost share.

How BW&CO Can Help

BW&CO has helped deep-tech and dual-use founders secure more than $350M in non-dilutive funding. For consortium project calls like NextFlex 11.0, we help you:

  • Check fit: match your technology to the right topic
  • Build the team: line up an industrial partner and cost share
  • Write the proposal: frame the maturation and integration plan
  • Plan the budget: balance institute funds and matching funds
  • Plan the next step: connect the project to DoD and commercial customers

Plan Your NextFlex Proposal

Frequently Asked Questions

Who runs Project Call 11.0?

NextFlex, the Manufacturing USA institute for flexible hybrid electronics.

How much funding is available?

Up to about $3.0M in total, with up to $500,000 or $1,000,000 in institute funds per project depending on the topic.

How many projects will be funded?

NextFlex anticipates funding one project in each topic area.

When is it due?

A mandatory cover sheet is due December 2, 2026, and full proposals are due December 9, 2026, 5:00 PM PT.

Is cost share required?

Yes, at least 1:1.

Do I need to be a NextFlex member?

Not to submit. Funded non-members must join at a qualifying tier before the agreement is finalized.

Can non-U.S. teams apply?

Teams need a significant U.S. presence, and all funds must be spent in the U.S.

How long can a project run?

Up to 18 months per the Guidebook.

Can BW&CO help with a NextFlex proposal?

Yes. BW&CO can help you pick a topic, build the team and cost share, and write the proposal. Book a call with our team.

Source: NextFlex: Project Call 11.0 Industrialization and Integration

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